High-quality and high-efficiency cutting from difficult-to-cut materials such as SiC or ceramic to composite materials such as glass and resins.
The ultrasonic cutting machine is a machine with the ability to cut difficult-to-cut materials such as composite materials - glass and silicon multilayer substrates, etc. - at high speeds and with high quality, including materials with high levels of hardness such as SiC (silicon carbide), LTCC (low temperature co-fired ceramics), alumina and ceramics, for which mass production with conventional dicing machines has been difficult.
The mass production level in 80μm Street of the SiC wafer, through development of the original spindle and special ultrasonic blade to maximize the ultrasonic effect.
|Cutting speed||20 mm/s （pattern wafer）|
|Blade life||240m/blade (Approx.20wafers continues cutting in 6inches □3mm chip)|
Can cut workpieces up to 8 inches.
|Maximum workpiece size that can be cut||8 inches|
|Maximum workpiece height that can be cut||2 mm|
|Operation / display section||Touch panel|
|Utilities||3-phase 200 V 30 A, municipal water, compressed air, liquid waste, ventilation|
|Machine sizes||1,240(W) x 1,020(D) x 1,700(H)||840(W) x 1,020(D) x 1,700(H)|
|Weight||1,800 kg||1,500 kg|
Please don't hesitate to contact us with questions about our equipment.
• Electronics Equipment Division
Assigned to: Furuki & Hirano