The TFC series is used during the wafer cutting (dicing) process
The tape residue and fingerprints adhering to the dicing frame is removed using jets.
Deterioration of cleaning performance due to transfer of glue and other adhesives is prevented because there are no contact parts such as brushes.
|Application||Single-wafer dicing frame cleaning|
|Targeted ring frame(s)||Material||Ring frames for dicing|
|Size||For standard 6-inch wafers (handles various sizes)|
|Number of processing stations||Single chamber (expandable)|
|Process liquids||Organic stripping solution(s) and purified water|
|Scrap features||High-pressure jet(s)|
|Conveyance robot||SCARA robot with centering feature|
Please don't hesitate to contact us with questions about our equipment.
• Electronics Equipment Division
Assigned to: Furuki & Hirano